Swiss army SoC of a chip
- Category: Fujitsu
Swiss army SoC of a chip
Dual core SoC with all these goodies for Wi-Fi TV tuner applications?
"Featuring a dual-core ARM Cortex-A9 processor (~500MHz operations) as its CPU core, MB86E631 brings together a total of 10 different interfaces—including USB2.0/3.0, Serial ATA, PCI Express, Ethernet MAC and TS—all on a single chip. Not only is the product optimal for use together with a transcoder LSI in Wi-Fi TV tuner applications SoC, but it can also be employed as a CPU for interface control in multi-tuner devices and other applications in which control of multiple interfaces is required. In addition, the new chip will lead to the development of a new market that extends beyond video delivery and recording devices to include products that require performance greater than that of microcontrollers and support for multiple interfaces."
210 new Cortex-M3 MCUs from Fujitsu
- Category: Fujitsu
210 new Cortex-M3 MCUs from Fujitsu
And more to come
"The new products expand all four product groups that comprise the FM3 family – the High-Performance, Basic, Low Power, and Ultra-Low-Leak groups. With the addition of the new products, the FM3 family now includes 370 products. Fujitsu plans to continue expanding the product line to reach more than 500 products by the end of FY2012. "
"High-Performance Group (MB9B510/410/310/110N/R Series)
The devices feature a 144MHz CPU, a full array of peripheral and communications functions (including USB 2.0 and CAN), a real-time clock, and inverter control functions able to control up to three motors. Products are available with 160KB to 544KB Flash memory and in 120-pin or 100-pin packages.
Basic Group (MB9A310/110K Series)
Other features include USB 2.0, a real-time clock, and 160KB and 96KB Flash memory alternatives, including a 32KB independent flash bank for EEPROM emulation The devices are available in 48-pin packages.
Low-Power Group (MB9AB40-/A40/340/140L/M/N Series)
The low-voltage operation of this product group helps reduce power consumption during operation and extend battery life. The devices, which are available in 288KB, 160KB or 96KB Flash memory alternatives, come in 100-pin, 80-pin and 64-pin packages and include USB and a real-time clock. Dual Operation Flash with a separate 32KB flash bank allows EEPROM emulation.
Ultra-Low-Leak Group (MB9AA30/130L/M/N Series)
The MCUs are available in 100-pin, 80-pin and 64-pin packages and with 128KB or 64KB Flash memory configurations. The devices feature an LCD controller and a real-time clock. A wide voltage range of 5.5V to 1.8V makes these products well-suited for battery-powered applications"
Fujitsu adds performance chips to the FM3 family of microcontrollers
- Category: Fujitsu
Fujitsu adds performance chips to the FM3 family of microcontrollers
"The new products are members of the High Performance Group including the MB9B610/D10/510/410/310//110 Series. These series are designed for processing-intensive system controllers and communications-oriented systems, with CAN and USB2.0 functionality, as well as the industry's first 2-channel Ethernet-MAC support in a Cortex-M3 Microcontroller."
Fujitsu Semiconductor, and farm management demonstration using ARM MCUs
- Category: Fujitsu
Fujitsu Semiconductor, and farm management demonstration using ARM MCUs
Original article is in Japanese but is definitly worth reading even if the transalation is somewhat flaky.
"The first "green factory system" is a demo model to control the situation. ( 1 figure ). Green factory system, the "farm" intelligent hygrometer and thermometer to achieve a total volume of water, then use the data collected by various sensors such as light meter, blower machines and illumination of the farm, the sprinkler system control means."
"1つ目は、「グリーンファクトリシステム」を制御する状況を模したデモである。（図1）。グリーンファクトリシステムとは、「インテリジェントな農場」を実現するために温度計や湿度計、水量計、照度計といったさまざまなセンサーで収集したデータを活用して、農場の照光機や送風機、散水機を制御するシステムをいう。"
Fujitsu invents new heart shape MCU package!
- Category: Fujitsu
Fujitsu invents new heart shape MCU package!
For now it is just a marketting gimmick but it seems like a sensible idea for extending the reach of their chips! There are no technical reasons to package the chips in square or reactangular packages only so a heart shaped one would have a lot of appeal for engineers around February 14.
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