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Packages/Packages
Author:Administrator
Intel's Packaging Databook serves as a data reference for engineering design, and a guide to Intel package selection and availability. Each chapter provides a comprehensive and in-depth analysis of Intel packaging technology, from information on IC...
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Packages/Articles
Author:Administrator
"RELIABILITY QUALIFICATION OF QUAD FLAT NO-LEAD PACKAGE DEVICES"
Thesis published in 2009
Abstract
This thesis presents a description of an efficient and effective reliability qualification flow for Quad Flat No-Lead (QFN) Package Devices. A...
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